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| 商品编号: |
DVD12453 |
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| 商品名稱： |
DynaForm 5.9.4-用於板料成形數值模擬的專用軟件 |
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| 碟片數量： |
1片 |
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| 銷售價格： |
100 |
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| 瀏覽次數： |
10093 |
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【轉載TXT文檔】 |
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| DynaForm 5.9.4-用於板料成形數值模擬的專用軟件 |
DYNAFORM軟件是美國ETA公司和LSTC公司聯合開發的用於板料成形數值模擬的專用軟件，是LS-DYNA求解器與ETA/FEMB前後處理器的完美結合，是當今流行的板料成形與模具設計的CAE工具之一。
Dynaform 軟件基於有限元方法建立, 被用於模擬鈑金成形工藝。Dynaform軟件包含BSE、DFE、Formability三個大模塊，幾乎涵蓋沖壓模模面設計的所有要素，包括：定最佳沖壓方向、坯料的設計、工藝補充面的設計、拉延筋的設計、凸凹模圓角設計、沖壓速度的設置、壓邊力的設計、摩擦係數、切邊線的求解、壓力機噸位等。
Dynaform軟件可應用於不同的領域，汽車、航空航天、家電、廚房衛生等行業。可以預測成形過程中板料的裂紋、起皺、減薄、劃痕、回彈、成形剛度、表面質量，評估板料的成形性能，從而為板成形工藝及模具設計提供幫助。
Dynaform軟件設置過程與實際生產過程一致，操作上手容易。來設計可以對沖壓生產的全過程進行模擬：坯料在重力作用下的變形、壓邊圈閉合過程、拉延過程、切邊回彈、回彈補償、翻邊、脹形、液壓成形、彎管成形。
Dynaform軟件適用的設備有：單動壓力機、雙動壓力機、無壓邊壓力機、螺旋壓力機、鍛錘、組合模具和特種鍛壓設備等。
Engineering Technology Associates, Inc. (ETA) announced the release of DYNAFORM Version 5.9. In the new version, a brand new module, incorporating optimization, has been unveiled. The Optimization Platform (OP) makes DYNAFORM the most complete and powerful solution on the market for die system simulation and optimization.
DynaForm 5.9
ETA has embedded Red Cedar’s proprietary optimization technology, SHERPA, into the OP module. The module is focused on supporting optimization of drawbead forces along with binder pressure, lubrication, gage, and material.
DynaForm 5.9
Using the newest optimization technology, the OP module reduces product development time and cost for manufacturing by reducing incidents of wrinkling, thinning and tearing with limited effort. The OP guided user interface makes optimization viable for a larger set of users, since special optimization expertise is not required. Additionally, the latest computing platforms combined with an efficient solver eliminate demanding computing requirements. The solver is an incremental solution (INCSolver) that delivers exceptional speed, taking advantage of Shared Memory Processing (SMP) computing technology on multiple core machines running Windows 7 and beyond.
ETA Dynaform 5.9.3
The OP module will use the same common interface as the other four modules of DYNAFORM that include Blank Size Engineering (BSE), Die Face Engineering (DFE), Formability Simulation (FS), and Die System Analysis (DSA). Each of the four previously available modules has also been enhanced in the Version 5.9 software release.
Complete DYNAFORM Version 5.9 Release Notes, are now available online at DYNAFORM59Release
About Engineering Technology Associates, Inc.
Engineering Technology Associates, Inc. (ETA) was established in 1983 by advanced product development engineers working as structural analysts for the world’s largest automotive manufacturers. ETA’s expertise in the areas of vehicle durability, NVH, metal forming, crashworthiness, occupant safety and product design have provided an intimate knowledge of the challenges and needs of the product development engineer. Proactive in the creation and implementation of new analysis methods and software, ETA is the developer of the Inventium Suite, an enterprise product development solution that includes DYNAFORM.
Name: Dynaform
Version: 5.x
Home: http://eta.com/
Interface: english
OS: Windows XP / Vista / Seven
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